Supu New MC Series Dual-Layer High-Density Connectors — Efficient Space-Saving Design for Enhanced Connectivity

New MC Dual-Layer High-Density Connectors

MC-DRG2.54H Series Dual-Layer High-Density Connector Plug — Versatile Adaptation, Stable Transmission with Dual-Layer Interface

Designed for high-density dual-layer wiring scenarios, the MC-DRG2.54H connector plug offers various mounting options, including locking mechanisms, screw flanges, and latch designs. These flexible features enable secure connections and meet the modular circuit integration needs across diverse industries.

• Versatile Mounting Options: I-locking mechanism, K-screw flange, D-latch design, ensuring flexibility in different installation layouts.
  
  
• Precise Dual-Layer Alignment: 2.54mm standard pin pitch with anti-misconnection design for stable, error-free transmission.
  
  
• Efficient and Secure: Independent wiring zone and anti-disconnection lock, enabling streamlined wiring and easy maintenance.
  
  
• Durable and Weather-Resistant: PA66 housing with tin-plated contacts, designed for reliable performance in harsh environments.

MC-DPG2.54 Series Dual-Layer High-Density Connector Socket — Space-Saving Design for Efficient Connectivity

Optimized for PCB high-density wiring scenarios, the MC-DPG2.54 connector socket utilizes a 2.54mm standard pin pitch and dual-layer layout, offering significant space-saving benefits and reliable transmission. This solution is ideal for integrated circuit connections across various industries.

• Space-Saving Dual-Layer Design: With higher wiring density than traditional connectors, it reduces internal equipment footprint.
  
  
• Stable High-Density Transmission: Precise pin pitch and tin-plated contacts to avoid cross-talk and connection issues.
  
  
• Easy Maintenance: Direct dual-layer insertion design simplifies wiring and troubleshooting.
  
  
• Wide Compatibility and Durability: The PA66 housing withstands temperatures from -40°C to 105°C, ensuring stable operation under various conditions.

MC-DPJ2.54H Series Dual-Layer High-Density Connector Socket — Multi-Spec Adaptation, Stable Dual-Layer Connection

Designed for high-density dual-layer wiring, the MC-DPJ2.54H socket complements the MC-DPG series socket with five different mounting configurations. These ensure precise alignment, easy insertion and removal, and accommodate a wide range of modular circuit connections.

• Multiple Mounting Options: Five configurations (D/F/I/W/DW) for flexibility in different layouts.
  
  
• Precise Dual-Layer Alignment: 2.54mm standard pin pitch with anti-misconnection design for stable and accurate connections.
  
  
• Efficient and Easy to Maintain: Lightweight insertion/removal with clear markings for module installation and troubleshooting.
  
  
• High Efficiency and Durability: PA66 housing and tin-plated contacts designed to operate efficiently in extreme temperatures (-40°C to 105°C).

For more information about Supu Electronics and its MC Double-Layer High-Density Connectors, visit www.supucontact.com.

Email：supucontact@supu.cn

Phone：400-626-6336